SZSE:002741
Hole Conduction Process
Information
Application:

It refers to electroless copper for vertical equipment, and serves for the deposition of a uniform layer of copper on hole of circuit board by chemical method to realize metallization for hole and provide copper plating with conduction conditions.

Advantage introduction:

Applicable to production demands for the boards with high aspect ratio and HDI, PTH bath load has wide applicable scope;
Stable PTH with high performance, compact PTH crystallization, good backlight effect;
PTH layer has good adhesive force and high thermal shock resistance;
PTH bath solution has low wastewater overflow, and is uneasy for copper sedimentation, indicating long maintenance period and good environmental friendliness.
 
 
 
 
Related Products

Copyright © Guangdong Guanghua Sci-Tech Co., Ltd. GuangDong ICP No. 14033791-1